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Management Side
Bemis Company Signs Joint Development Agreement
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Neenah, Wisconsin, USA 10 July 2012 -- Bemis Company, Inc. (NYSE: BMS) today announced that it has signed a joint development agreement with Thin Film Electronics ASA (OSE: THIN.OL) to develop a Bemis Intelligent Packaging Platform.  The agreement will accelerate the commercial development of functional sensor labels manufactured from new and emerging printed electronic technology made from Thin Film’s proprietary read/writable printed memory and program logic.  When used with Bemis packaging, the line of “intelligent” labels will monitor and record key physical properties and environmental data in packaged perishable products.
 
“Intelligent packaging is an emerging technology with many potential intersections with Bemis’ flexible packaging and pressure sensitive materials business segments,” said Henry Theisen, Bemis Company President and Chief Executive Officer.  “Our agreement with Thin Film Electronics ASA is an investment in technology that could eventually make printed electronics a component of every package we manufacture.”

The Bemis Intelligent Packaging Platform is expected to be commercially available in 2014.

ABOUT THIN FILM ELECTRONICS ASA

Thin Film Electronics ASA (Ticker: THIN.OL) is a leader in the development of printed electronics. The first to commercialize printed rewritable memory, Thinfilm is creating printed system products that will include memory, sensing, display and wireless communication—at a cost-per-functionality unmatched by any other electronic technology.  Thinfilm's roadmap of system products integrates technology from a strong and growing ecosystem of partners to enable the Internet of Things by bringing intelligence to disposable goods. Company headquarters are in Oslo, Norway, with product development in Linköping, Sweden, sales offices in San Francisco, USA, and Tokyo, Japan, and manufacturing in Pyongtaek, South Korea. www.thinfilm.no

ABOUT BEMIS COMPANY, INC.

Bemis Company, Inc. is a major supplier of flexible packaging and pressure sensitive materials used by leading food, consumer products, healthcare, and other companies worldwide.  Founded in 1858, the Company is included in the S&P 500 index of stocks and reported 2011 net sales of $5.3 billion.  The Company’s flexible packaging business has a strong technical base in polymer chemistry, film extrusion, coating and laminating, printing, and converting.  Headquartered in Neenah, Wisconsin, Bemis employs approximately 20,000 individuals worldwide.  More information about the Company is available at our website, www.bemis.com.



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